EDI8L32128C12AC vs EDI8L32128C12AC feature comparison

EDI8L32128C12AC White Microelectronics

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EDI8L32128C12AC Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WHITE MICROELECTRONICS MICROSEMI CORP
Package Description PLASTIC, LCC-68 PLASTIC, MO-47AE, LCC-68
Reach Compliance Code unknown unknown
Access Time-Max 12 ns 12 ns
Additional Feature ALSO CONFIGURABLE AS 512K X 8 ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX
Alternate Memory Width 16 16
JESD-30 Code S-PQCC-J68 S-PQCC-J68
Memory Density 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX32 128KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form J BEND J BEND
Terminal Position QUAD QUAD
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code LCC
Pin Count 68
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Length 24.2824 mm
Package Code QCCJ
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 4.572 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 24.2824 mm

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