EDI8L24512V20AI
vs
EDI8L24512V15AC
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
WHITE ELECTRONIC DESIGNS CORP
|
Package Description |
PLASTIC, MO-47AE, LCC-68
|
PLASTIC, MO-47AE, LCC-68
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
20 ns
|
15 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PQCC-J68
|
S-PQCC-J68
|
JESD-609 Code |
e0
|
e0
|
Length |
24.2316 mm
|
24.2316 mm
|
Memory Density |
12582912 bit
|
12582912 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
24
|
24
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512KX24
|
512KX24
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC68,1.0SQ
|
LDCC68,1.0SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Standby Current-Max |
0.03 A
|
0.03 A
|
Standby Voltage-Min |
3.14 V
|
3.14 V
|
Supply Current-Max |
0.48 mA
|
0.54 mA
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.2316 mm
|
24.2316 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EDI8L24512V20AI with alternatives
Compare EDI8L24512V15AC with alternatives