EDI8L24257V12BC vs CYM26KAH24AV33-12BGI feature comparison

EDI8L24257V12BC White Microelectronics

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CYM26KAH24AV33-12BGI Cypress Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WHITE MICROELECTRONICS CYPRESS SEMICONDUCTOR CORP
Package Description MO-163, BGA-119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
Reach Compliance Code unknown compliant
Access Time-Max 12 ns 12 ns
JESD-30 Code R-PBGA-B119 R-PBGA-B119
Memory Density 6291456 bit 6291456 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 24 24
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX24 256KX24
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Rohs Code No
Part Package Code BGA
Pin Count 119
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
I/O Type COMMON
JESD-609 Code e0
Length 22 mm
Output Characteristics 3-STATE
Package Code BGA
Package Equivalence Code BGA119,7X17,50
Seated Height-Max 2.4 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.19 mA
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 14 mm

Compare EDI8L24257V12BC with alternatives

Compare CYM26KAH24AV33-12BGI with alternatives