EDI8F8512LP85BSI
vs
MS8512RKXAL-12
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ELECTRONIC DESIGNS INC
MOSAIC SEMICONDUCTOR INC
Reach Compliance Code
unknown
unknown
Access Time-Max
85 ns
120 ns
Additional Feature
TTL COMPATIBLE INPUT OUTPUT
ASIC PINOUT
I/O Type
COMMON
JESD-30 Code
R-XSMA-T36
R-XSMA-T36
JESD-609 Code
e0
Memory Density
4194304 bit
4194304 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
36
36
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512KX8
512KX8
Output Characteristics
3-STATE
Output Enable
YES
YES
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Equivalence Code
SIP36
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.000125 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.13 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
SINGLE
SINGLE
Base Number Matches
2
2
Package Description
,
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
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