EDI88512LPA25F36C vs 5962-9560003MTC feature comparison

EDI88512LPA25F36C White Microelectronics

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5962-9560003MTC Micross Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WHITE MICROELECTRONICS MICROSS COMPONENTS
Package Description CERAMIC, FP-36 DFP,
Reach Compliance Code unknown compliant
Access Time-Max 25 ns 25 ns
JESD-30 Code R-CDFP-F36 R-CDFP-F36
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 36 36
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form FLAT FLAT
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DFP
Pin Count 36
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
JESD-609 Code e4
Length 23.368 mm
Package Code DFP
Screening Level MIL-STD-883
Seated Height-Max 2.8956 mm
Terminal Finish GOLD
Terminal Pitch 1.27 mm
Width 12.954 mm

Compare EDI88512LPA25F36C with alternatives

Compare 5962-9560003MTC with alternatives