EDI88512LPA25F36C
vs
EDI88512LPA25F36M
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
WHITE MICROELECTRONICS
|
Package Description |
CERAMIC, DFP-36
|
CERAMIC, FP-36
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
25 ns
|
25 ns
|
Additional Feature |
TTL COMPATIBLE INPUTS/OUTPUTS
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-CDFP-F36
|
R-CDFP-F36
|
Length |
23.368 mm
|
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
36
|
36
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
512KX8
|
512KX8
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DFP
|
DFP
|
Package Equivalence Code |
FL36,.5
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.175 mm
|
|
Standby Current-Max |
0.002 A
|
|
Standby Voltage-Min |
2 V
|
|
Supply Current-Max |
0.225 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
12.954 mm
|
|
Base Number Matches |
5
|
5
|
ECCN Code |
|
3A001.A.2.C
|
HTS Code |
|
8542.32.00.41
|
Screening Level |
|
MIL-PRF-38535
|
|
|
|
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