EDI88512LPA25F36C vs EDI88512LPA25F36M feature comparison

EDI88512LPA25F36C White Electronic Designs Corp

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EDI88512LPA25F36M White Microelectronics

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP WHITE MICROELECTRONICS
Package Description CERAMIC, DFP-36 CERAMIC, FP-36
Reach Compliance Code unknown unknown
Access Time-Max 25 ns 25 ns
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS
I/O Type COMMON
JESD-30 Code R-CDFP-F36 R-CDFP-F36
Length 23.368 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 36 36
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DFP
Package Equivalence Code FL36,.5
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.175 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.225 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 12.954 mm
Base Number Matches 5 5
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Screening Level MIL-PRF-38535

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