EDI88512LPA25F32I
vs
EDI88130LPS55NB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DFP
SOJ
Package Description
CERAMIC, DFP-32
CERAMIC, SOJ-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
55 ns
Additional Feature
TTL COMPATIBLE INPUTS/OUTPUTS; LG-MAX
BATTERY BACKUP OPERATION
I/O Type
COMMON
COMMON
JESD-30 Code
R-CDFP-F32
R-CDSO-J32
Length
21.2852 mm
21.082 mm
Memory Density
4194304 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
131072 words
Number of Words Code
512000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
512KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
SOJ
Package Equivalence Code
FL32,.4
SOJ32,.44
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.8448 mm
3.937 mm
Standby Current-Max
0.002 A
0.002 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.225 mA
0.2 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
FLAT
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
10.7442 mm
11.05 mm
Base Number Matches
1
1
Screening Level
MIL-STD-883
Compare EDI88512LPA25F32I with alternatives
Compare EDI88130LPS55NB with alternatives