EDI88130LPS55NB
vs
EDI88130LPS55NC
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
WHITE ELECTRONIC DESIGNS CORP
Package Description
CERAMIC, SOJ-32
CERAMIC, SOJ-32
Reach Compliance Code
unknown
unknown
Access Time-Max
55 ns
55 ns
Additional Feature
BATTERY BACKUP OPERATION
BATTERY BACKUP OPERATION
I/O Type
COMMON
COMMON
JESD-30 Code
R-CDSO-J32
R-CDSO-J32
Length
21.082 mm
21.082 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
SOJ
SOJ
Package Equivalence Code
SOJ32,.44
SOJ32,.44
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
3.937 mm
3.937 mm
Standby Current-Max
0.002 A
0.002 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.2 mA
0.2 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
11.05 mm
11.05 mm
Base Number Matches
5
4