EDI88512C85CM vs EDI88512LP85CM feature comparison

EDI88512C85CM Microsemi Corporation

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EDI88512LP85CM Mercury Systems Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer MICROSEMI CORP MERCURY SYSTEMS INC
Part Package Code DIP
Package Description 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 85 ns 85 ns
JESD-30 Code R-CDIP-T32 R-CDIP-T32
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512KX8 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 10.16 mm 15.24 mm
Base Number Matches 5 5
I/O Type COMMON
Length 40.64 mm
Output Enable YES
Package Equivalence Code DIP32,.6
Seated Height-Max 3.937 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.075 mA
Terminal Pitch 2.54 mm

Compare EDI88512C85CM with alternatives

Compare EDI88512LP85CM with alternatives