EDI88130CS45TM vs MT5C1008C-45/XT feature comparison

EDI88130CS45TM Microsemi Corporation

Buy Now Datasheet

MT5C1008C-45/XT Micross Components

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP AUSTIN SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 0.400 INCH, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 45 ns
JESD-30 Code R-CDIP-T32 R-CDIP-T32
Length 40.64 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 3.937 mm 5.8928 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm 10.16 mm
Base Number Matches 5 1
Pbfree Code No
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS, 2V DATA RETENTION, BATTERY BACKUP, LOW POWER STANDBY
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare EDI88130CS45TM with alternatives

Compare MT5C1008C-45/XT with alternatives