EDI88130CS45TM vs EDI88130CS45TB feature comparison

EDI88130CS45TM Microsemi Corporation

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EDI88130CS45TB Electronic Designs Inc

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP ELECTRONIC DESIGNS INC
Part Package Code DIP
Package Description 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 45 ns 45 ns
JESD-30 Code R-CDIP-T32 R-CDIP-T32
Length 40.64 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 38535Q/M;38534H;883B
Seated Height-Max 3.937 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm
Base Number Matches 5 5
Additional Feature BATTERY BACKUP OPERATION
I/O Type COMMON
JESD-609 Code e0
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Package Equivalence Code DIP32,.4
Standby Current-Max 0.01 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.2 mA
Terminal Finish Tin/Lead (Sn/Pb)

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