EDI88130CS45TM vs 8959826BXC feature comparison

EDI88130CS45TM Microsemi Corporation

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8959826BXC Micross Components

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP AUSTIN SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 DIP,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 55 ns
JESD-30 Code R-CDIP-T32 R-CDIP-T32
Length 40.64 mm 40.64 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 3.937 mm 4.34 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm 15.24 mm
Base Number Matches 1 1
JESD-609 Code e4
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Terminal Finish PALLADIUM GOLD

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