EDI88130CS17L32I
vs
AT68166FT-YS20-SCC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
ATMEL CORP
Part Package Code
QFJ
QFP
Package Description
LCC-32
QFF, TPAK68,2.5SQ
Pin Count
32
68
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.B
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
17 ns
20 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-CQCC-N32
S-CQFP-F68
Length
13.97 mm
24.14 mm
Memory Density
1048576 bit
16777216 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
32
68
Number of Words
131072 words
524288 words
Number of Words Code
128000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
128KX8
512KX32
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QFF
Package Equivalence Code
LCC32,.45X.55
TPAK68,2.5SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
4.7 mm
Standby Current-Max
0.01 A
0.0045 A
Standby Voltage-Min
4.5 V
2 V
Supply Current-Max
0.3 mA
0.165 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
NO LEAD
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
24.14 mm
Base Number Matches
1
1
Pbfree Code
Additional Feature
IT CAN BE USED AS 2 BANK OF 512K X 16 OR 4 BANK OF 512K X 8 ALSO
Moisture Sensitivity Level
1
Screening Level
ESCC9000
Compare EDI88130CS17L32I with alternatives
Compare AT68166FT-YS20-SCC with alternatives