EDI8466CB15LI vs KM64259BP-15 feature comparison

EDI8466CB15LI Electronic Designs Inc

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KM64259BP-15 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ELECTRONIC DESIGNS INC SAMSUNG SEMICONDUCTOR INC
Reach Compliance Code unknown unknown
Access Time-Max 15 ns 15 ns
JESD-30 Code R-CQCC-N28 R-PDIP-T28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64KX4 64KX4
Output Characteristics 3-STATE 3-STATE
Output Enable YES NO
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCN DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position QUAD DUAL
Base Number Matches 1 1
Rohs Code No
Part Package Code DIP
Package Description DIP, DIP28,.3
Pin Count 28
ECCN Code EAR99
HTS Code 8542.32.00.41
I/O Type SEPARATE
JESD-609 Code e0
Length 34.415 mm
Package Equivalence Code DIP28,.3
Seated Height-Max 5.08 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.14 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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Compare KM64259BP-15 with alternatives