EDI8465LP25QB vs MSM832TLMB-10 feature comparison

EDI8465LP25QB Electronic Designs Inc

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MSM832TLMB-10 Mosaic Semiconductor Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ELECTRONIC DESIGNS INC MOSAIC SEMICONDUCTOR INC
Reach Compliance Code unknown unknown
Access Time-Max 25 ns 100 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T24 R-CDIP-T28
JESD-609 Code e0
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 24 28
Number of Words 65536 words 32768 words
Number of Words Code 64000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 64KX4 32KX8
Output Characteristics 3-STATE
Output Enable NO YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B MIL-STD-883
Standby Current-Max 0.0005 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Package Description ,
Pin Count 28
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41

Compare EDI8465LP25QB with alternatives

Compare MSM832TLMB-10 with alternatives