EDI7F33IMC150BNC
vs
EDI7F233512C150BNI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
,
,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
150 ns
150 ns
Additional Feature
100K ENDURANCE CYCLES
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-XSMA-N80
R-XSMA-N80
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH MODULE
FLASH MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
80
80
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Organization
1MX32
1MX32
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Terminal Form
NO LEAD
NO LEAD
Terminal Position
SINGLE
SINGLE
Base Number Matches
3
3
Pbfree Code
Rohs Code
Part Package Code
SIMM
Pin Count
80
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Temperature Grade
INDUSTRIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare EDI7F33IMC150BNC with alternatives
Compare EDI7F233512C150BNI with alternatives