EBVW020A0B641Z
vs
07HB-D0T12WG
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
GE INDUSTRIAL SOLUTIONS
|
BEL FUSE INC
|
| Package Description |
Eight brick package-8
|
HALF BRICK, PACKAGE-11
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Analog IC - Other Type |
DC-DC REGULATED POWER SUPPLY MODULE
|
DC-DC REGULATED POWER SUPPLY MODULE
|
| Approvals |
UL, CSA, IEC, EN, VDE
|
|
| Control Mode |
VOLTAGE-MODE
|
|
| Efficiency (Main Output) |
95.2%
|
|
| Input Voltage-Max |
75 V
|
75 V
|
| Input Voltage-Min |
36 V
|
36 V
|
| Input Voltage-Nom |
48 V
|
48 V
|
| JESD-30 Code |
R-XDMA-X8
|
R-XDMA-P11
|
| Length |
58.4 mm
|
60.69 mm
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
8
|
11
|
| Output Current-Max |
20 A
|
|
| Output Voltage-Max |
12.24 V
|
13.2 V
|
| Output Voltage-Min |
11.76 V
|
9.6 V
|
| Output Voltage-Nom |
12 V
|
12 V
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DMA
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Protections |
OUTPUT OVER CURRENT; OUTPUT OVER VOLTAGE; THERMAL
|
|
| Seated Height-Max |
11.8 mm
|
10.67 mm
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Terminal Form |
UNSPECIFIED
|
PIN/PEG
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Power Output-Max |
240 W
|
240 W
|
| Trim/Adjustable Output |
NO
|
YES
|
| Width |
22.8 mm
|
57.91 mm
|
| Base Number Matches |
4
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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