DSPIC33FJ64GP202T-E/MMVAO
vs
DSPIC33FJ32MC202-I/SP
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QFN-28
|
DIP, DIP28,.31
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Barrel Shifter |
YES
|
YES
|
Bit Size |
16
|
16
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
External Data Bus Width |
|
|
Format |
FLOATING POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PQCC-N28
|
R-PDIP-T28
|
JESD-609 Code |
e3
|
e3
|
Length |
4 mm
|
34.671 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
8
|
|
Number of External Interrupts |
3
|
3
|
Number of Serial I/Os |
3
|
1
|
Number of Terminals |
28
|
28
|
Number of Timers |
7
|
5
|
On Chip Data RAM Width |
8
|
8
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
DIP
|
Package Equivalence Code |
LCC28,.16SQ,16
|
DIP28,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
RAM (words) |
8192
|
2048
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
AEC-Q100
|
TS 16949
|
Seated Height-Max |
0.55 mm
|
5.08 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
0.4 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
4 mm
|
7.62 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
DIP
|
Pin Count |
|
28
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Has ADC |
|
YES
|
DAC Channels |
|
NO
|
DMA Channels |
|
NO
|
Number of I/O Lines |
|
21
|
On Chip Program ROM Width |
|
24
|
PWM Channels |
|
YES
|
Qualification Status |
|
Not Qualified
|
Speed |
|
40 MHz
|
Supply Current-Max |
|
80 mA
|
|
|
|
Compare DSPIC33FJ64GP202T-E/MMVAO with alternatives
Compare DSPIC33FJ32MC202-I/SP with alternatives