DSPIC33FJ64GP202T-E/MMVAO
vs
DSPIC33FJ32GS608-E/PT
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QFN-28
|
12 X 12 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-80
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Barrel Shifter |
YES
|
YES
|
Bit Size |
16
|
16
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
External Data Bus Width |
|
|
Format |
FLOATING POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PQCC-N28
|
S-PQFP-G80
|
JESD-609 Code |
e3
|
e3
|
Length |
4 mm
|
12 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
8
|
4
|
Number of External Interrupts |
3
|
5
|
Number of Serial I/Os |
3
|
2
|
Number of Terminals |
28
|
80
|
Number of Timers |
7
|
8
|
On Chip Data RAM Width |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
TQFP
|
Package Equivalence Code |
LCC28,.16SQ,16
|
TQFP80,.55SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, THIN PROFILE
|
RAM (words) |
8192
|
4096
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
AEC-Q100
|
AEC-Q100; TS 16949
|
Seated Height-Max |
0.55 mm
|
1.2 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
4 mm
|
12 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
QFP
|
Pin Count |
|
80
|
Factory Lead Time |
|
6 Weeks
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
170 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare DSPIC33FJ64GP202T-E/MMVAO with alternatives
Compare DSPIC33FJ32GS608-E/PT with alternatives