DSPIC33EV256GM002-E/SP
vs
DSPIC33EV256GM002-M/SP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
SDIP-28
SPDIP-28
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Microchip
Has ADC
YES
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
NO
NO
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
DMA Channels
YES
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
JESD-609 Code
e3
Length
34.671 mm
34.671 mm
Low Power Mode
YES
YES
Number of DMA Channels
4
4
Number of External Interrupts
3
3
Number of I/O Lines
21
Number of Terminals
28
28
Number of Timers
7
7
On Chip Data RAM Width
8
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
RAM (bytes)
16384
RAM (words)
16384
16384
ROM (words)
262144
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100; TS 16949
Seated Height-Max
5.08 mm
5.08 mm
Speed
40 MHz
Supply Current-Max
350 mA
31 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Number of Serial I/Os
2
Compare DSPIC33EV256GM002-E/SP with alternatives
Compare DSPIC33EV256GM002-M/SP with alternatives