DSPIC33EP32GS502T-E/MMVAO
vs
DSPIC33EP16GS506T-E/PT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
QFN-28
TQFP-64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
60 MHz
60 MHz
External Data Bus Width
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQCC-N28
S-PQFP-G64
JESD-609 Code
e3
e3
Length
4 mm
10 mm
Low Power Mode
YES
YES
Number of Terminals
28
64
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TFQFP
Package Equivalence Code
LCC28,.16SQ,16
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, THIN PROFILE, FINE PITCH
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100; TS 16949
AEC-Q100; TS 16949
Seated Height-Max
0.55 mm
1.2 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.4 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
4 mm
10 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Samacsys Manufacturer
Microchip
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare DSPIC33EP32GS502T-E/MMVAO with alternatives
Compare DSPIC33EP16GS506T-E/PT with alternatives