DSPIC33EP128GM310T-I/PT
vs
DSP56F802TA60E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Package Description
TQFP-100
,
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Barrel Shifter
YES
Bit Size
16
Boundary Scan
YES
Clock Frequency-Max
60 MHz
External Data Bus Width
Format
FIXED POINT
Integrated Cache
NO
Internal Bus Architecture
MULTIPLE
JESD-30 Code
S-PQFP-G100
JESD-609 Code
e3
Length
12 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of DMA Channels
4
Number of External Interrupts
5
Number of Serial I/Os
4
Number of Terminals
100
Number of Timers
13
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TFQFP
Package Equivalence Code
TQFP100,.55SQ,16
Package Shape
SQUARE
Package Style
FLATPACK, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
RAM (words)
16384
ROM Programmability
FLASH
Screening Level
TS 16949
Seated Height-Max
1.2 mm
Supply Current-Max
60 mA
Supply Voltage-Max
3.6 V
Supply Voltage-Min
3 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
Terminal Pitch
0.4 mm
Terminal Position
QUAD
Width
12 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Date Of Intro
2018-04-15
Samacsys Manufacturer
NXP
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare DSPIC33EP128GM310T-I/PT with alternatives
Compare DSP56F802TA60E with alternatives