DSPIC33CK32MP102T-E/2N
vs
DSPIC33CK64MP102-I/2N
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
UQFN-28
|
UQFN-28
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Barrel Shifter |
YES
|
YES
|
Bit Size |
16
|
16
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
64 MHz
|
64 MHz
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PQCC-N28
|
S-PQCC-N28
|
Length |
6 mm
|
6 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
4
|
4
|
Number of External Interrupts |
4
|
4
|
Number of Serial I/Os |
3
|
3
|
Number of Terminals |
28
|
28
|
Number of Timers |
4
|
4
|
On Chip Data RAM Width |
8
|
8
|
On Chip Program ROM Width |
24
|
24
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC28,.24SQ,25
|
LCC28,.24SQ,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
RAM (words) |
8192
|
8192
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
AEC-Q100; TS 16949
|
TS 16949
|
Seated Height-Max |
0.55 mm
|
0.55 mm
|
Supply Current-Max |
35 mA
|
35 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
6 mm
|
6 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
15 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
JESD-609 Code |
|
e3
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Terminal Finish |
|
Matte Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare DSPIC33CK32MP102T-E/2N with alternatives
Compare DSPIC33CK64MP102-I/2N with alternatives