DSPIC33CH256MP206TI/MR
vs
DSPIC33CH256MP206-H/MR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
HVQCCN, LCC64,.35SQ,20
QFN-64
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Date Of Intro
2018-11-15
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
64 MHz
64 MHz
External Data Bus Width
Internal Bus Architecture
MULTIPLE
MULTIPLE
Low Power Mode
YES
YES
Operating Temperature-Max
85 °C
150 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Code
QFP
HVQCCN
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Additional Feature
16kbytes slave core Ram available
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-PQCC-N64
JESD-609 Code
e3
Length
9 mm
Number of DMA Channels
8
Number of External Interrupts
3
Number of Serial I/Os
2
Number of Terminals
64
Number of Timers
6
On Chip Data RAM Width
8
On Chip Program ROM Width
24
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
LCC64,.35SQ,20
Package Shape
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
RAM (words)
32768
ROM Programmability
FLASH
Seated Height-Max
1 mm
Supply Current-Max
98 mA
Surface Mount
YES
Technology
CMOS
Terminal Finish
Matte Tin (Sn)
Terminal Form
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
9 mm
Compare DSPIC33CH256MP206TI/MR with alternatives
Compare DSPIC33CH256MP206-H/MR with alternatives