DSPIC33CH256MP206-H/MR vs DSPIC33CH256MP206I-MR feature comparison

DSPIC33CH256MP206-H/MR Microchip Technology Inc

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DSPIC33CH256MP206I-MR Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description QFN-64 HVQCCN,
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature 16kbytes slave core Ram available
Address Bus Width
Barrel Shifter YES YES
Bit Size 16 16
Boundary Scan YES YES
Clock Frequency-Max 64 MHz 64 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQCC-N64 S-PQCC-N64
JESD-609 Code e3 e3
Length 9 mm 9 mm
Low Power Mode YES YES
Number of DMA Channels 8 8
Number of External Interrupts 3 3
Number of Serial I/Os 2 2
Number of Terminals 64 64
Number of Timers 6 5
On Chip Data RAM Width 8 8
On Chip Program ROM Width 24 24
Operating Temperature-Max 150 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC64,.35SQ,20 LCC64,.35SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
RAM (words) 32768 32768
ROM Programmability FLASH FLASH
Seated Height-Max 1 mm 1 mm
Supply Current-Max 98 mA 98 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 9 mm 9 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, CONTROLLER DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 1 1
Screening Level TS 16949

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