DSPIC30F2011BT-30I/P
vs
DSPIC30F2011AT-30EML-ES
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
QFN
Package Description
0.300 INCH, PLASTIC, DIP-18
8 X 8 MM, PLASTIC, QFN-44
Pin Count
18
44
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
NO
YES
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
R-PDIP-T18
S-PQCC-N44
Length
22.86 mm
8 mm
Low Power Mode
YES
YES
Number of Terminals
18
44
On Chip Program ROM Width
24
24
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
VQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER, VERY THIN PROFILE
ROM Programmability
FLASH
FLASH
Screening Level
TS 16949
TS 16949
Seated Height-Max
5.334 mm
1 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.5 V
2.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
8 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e3
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Terminal Finish
Matte Tin (Sn)
Compare DSPIC30F2011BT-30I/P with alternatives
Compare DSPIC30F2011AT-30EML-ES with alternatives