DSPIC30F2011BT-30I/P vs DSPIC30F2011CT-30ESO-ES feature comparison

DSPIC30F2011BT-30I/P Microchip Technology Inc

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DSPIC30F2011CT-30ESO-ES Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP SOIC
Package Description 0.300 INCH, PLASTIC, DIP-18 0.300 INCH, PLASTIC, MS-013, SOIC-18
Pin Count 18 18
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Barrel Shifter YES YES
Bit Size 16 16
Boundary Scan NO YES
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code R-PDIP-T18 R-PDSO-G18
Length 22.86 mm 11.53 mm
Low Power Mode YES YES
Number of Terminals 18 18
On Chip Program ROM Width 24 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
ROM Programmability FLASH FLASH
Screening Level TS 16949 TS 16949
Seated Height-Max 5.334 mm 2.64 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.5 V 2.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.49 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, CONTROLLER DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e3
Moisture Sensitivity Level 1
Qualification Status Not Qualified
Terminal Finish Matte Tin (Sn)

Compare DSPIC30F2011BT-30I/P with alternatives

Compare DSPIC30F2011CT-30ESO-ES with alternatives