DSP56301FV100
vs
DSP56301VL80
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA,
|
,
|
| Pin Count |
252
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
24
|
|
| Barrel Shifter |
YES
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
100 MHz
|
|
| External Data Bus Width |
24
|
|
| Format |
FIXED POINT
|
|
| Internal Bus Architecture |
MULTIPLE
|
|
| JESD-30 Code |
S-PBGA-B252
|
|
| Length |
21 mm
|
|
| Low Power Mode |
YES
|
|
| Number of Terminals |
252
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.9 mm
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
21 mm
|
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare DSP56301FV100 with alternatives
Compare DSP56301VL80 with alternatives