DSP56301FV100 vs DSP56301PW100 feature comparison

DSP56301FV100 Motorola Mobility LLC

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DSP56301PW100 Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA QFP
Package Description BGA, PLASTIC, TQFP-208
Pin Count 252 208
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 24
Barrel Shifter YES YES
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 24 24
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B252 S-PQFP-G208
Length 21 mm 28 mm
Low Power Mode YES YES
Number of Terminals 252 208
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFQFP
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.6 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position BOTTOM QUAD
Width 21 mm 28 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1
Rohs Code No
Bit Size 24
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Equivalence Code QFP208,1.2SQ,20
Peak Reflow Temperature (Cel) 220
RAM (words) 4096
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

Compare DSP56301FV100 with alternatives

Compare DSP56301PW100 with alternatives