DSP56301FV100
vs
DSP56301PW100
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
QFP
|
Package Description |
BGA,
|
PLASTIC, TQFP-208
|
Pin Count |
252
|
208
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
24
|
Barrel Shifter |
YES
|
YES
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
100 MHz
|
100 MHz
|
External Data Bus Width |
24
|
24
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B252
|
S-PQFP-G208
|
Length |
21 mm
|
28 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
252
|
208
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.9 mm
|
1.6 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
21 mm
|
28 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Bit Size |
|
24
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Operating Temperature-Max |
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Equivalence Code |
|
QFP208,1.2SQ,20
|
Peak Reflow Temperature (Cel) |
|
220
|
RAM (words) |
|
4096
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare DSP56301FV100 with alternatives
Compare DSP56301PW100 with alternatives