DSP56301FV100
vs
DSP56301AG80
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
,
|
Pin Count |
252
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
|
Barrel Shifter |
YES
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
100 MHz
|
|
External Data Bus Width |
24
|
|
Format |
FIXED POINT
|
|
Internal Bus Architecture |
MULTIPLE
|
|
JESD-30 Code |
S-PBGA-B252
|
|
Length |
21 mm
|
|
Low Power Mode |
YES
|
|
Number of Terminals |
252
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.9 mm
|
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
3 V
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
21 mm
|
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare DSP56301FV100 with alternatives
Compare DSP56301AG80 with alternatives