DS96F174MMD8 vs HD26C31FP-E feature comparison

DS96F174MMD8 National Semiconductor Corporation

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HD26C31FP-E Renesas Electronics Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP RENESAS ELECTRONICS CORP
Package Description DIE, DIE OR CHIP SOP,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
High Level Input Current-Max 0.00002 A
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; EIA-485 EIA-422-A
JESD-30 Code X-XUUC-N R-PDSO-G16
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Out Swing-Min 1.5 V
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Equivalence Code DIE OR CHIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Receive Delay-Max
Screening Level 38535Q/M;38534H;883B
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Time@Peak Reflow Temperature-Max (s) 40
Transmit Delay-Max 25 ns 11 ns
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 16
JESD-609 Code e6
Length 10.06 mm
Number of Terminals 16
Seated Height-Max 2.2 mm
Terminal Finish TIN BISMUTH
Terminal Pitch 1.27 mm
Width 5.5 mm

Compare DS96F174MMD8 with alternatives

Compare HD26C31FP-E with alternatives