DS96F174MMD8
vs
HD26C31FP-E
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
RENESAS ELECTRONICS CORP
|
Package Description |
DIE, DIE OR CHIP
|
SOP,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Differential Output |
YES
|
YES
|
Driver Number of Bits |
4
|
4
|
High Level Input Current-Max |
0.00002 A
|
|
Input Characteristics |
STANDARD
|
STANDARD
|
Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
Interface Standard |
EIA-422; EIA-485
|
EIA-422-A
|
JESD-30 Code |
X-XUUC-N
|
R-PDSO-G16
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
4
|
4
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Out Swing-Min |
1.5 V
|
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
SOP
|
Package Equivalence Code |
DIE OR CHIP
|
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Receive Delay-Max |
|
|
Screening Level |
38535Q/M;38534H;883B
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UPPER
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Transmit Delay-Max |
25 ns
|
11 ns
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Pin Count |
|
16
|
JESD-609 Code |
|
e6
|
Length |
|
10.06 mm
|
Number of Terminals |
|
16
|
Seated Height-Max |
|
2.2 mm
|
Terminal Finish |
|
TIN BISMUTH
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
5.5 mm
|
|
|
|
Compare DS96F174MMD8 with alternatives
Compare HD26C31FP-E with alternatives