DS96F172MJ/883
vs
DS90LV027AMWC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
CERAMIC, DIP-16
DIE, WAFER
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
2
High Level Input Current-Max
0.00002 A
0.00001 A
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-422; EIA-485
EIA-644; TIA-644
JESD-30 Code
R-GDIP-T16
X-XUUC-N
JESD-609 Code
e0
Length
19.43 mm
Moisture Sensitivity Level
1
Number of Functions
4
2
Number of Terminals
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Out Swing-Min
1.5 V
0.25 V
Output Characteristics
3-STATE
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DIP
DIE
Package Equivalence Code
DIP16,.3
WAFER
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
IN-LINE
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Supply Voltage-Max
5.5 V
3.6 V
Supply Voltage-Min
4.5 V
3 V
Supply Voltage-Nom
5 V
3.3 V
Surface Mount
NO
YES
Technology
BIPOLAR
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
40
Transmit Delay-Max
25 ns
1.5 ns
Width
7.62 mm
Base Number Matches
2
2
Compare DS96F172MJ/883 with alternatives
Compare DS90LV027AMWC with alternatives