DS92LV1023MDC
vs
DS92LV1212TMSAX
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
DIE, DIE OR CHIP
SSOP, SSOP28,.3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
Driver Number of Bits
1
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE RECEIVER
Interface Standard
GENERAL PURPOSE
GENERAL PURPOSE
JESD-30 Code
X-XUUC-N
R-PDSO-G28
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SSOP
Package Equivalence Code
DIE OR CHIP
SSOP28,.3
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
90 mA
60 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Time@Peak Reflow Temperature-Max (s)
40
30
Base Number Matches
1
2
JESD-609 Code
e0
Length
10.2 mm
Number of Terminals
28
Receiver Number of Bits
1
Seated Height-Max
2 mm
Terminal Finish
TIN LEAD
Terminal Pitch
0.65 mm
Width
5.29 mm
Compare DS92LV1023MDC with alternatives
Compare DS92LV1212TMSAX with alternatives