DS90UH947TRGCRQ1
vs
DS90UH947TRGCTQ1
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
HVQCCN, LCC64,.35SQ,20
|
HVQCCN, LCC64,.35SQ,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
2
|
2
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| JESD-30 Code |
S-PQCC-N64
|
S-PQCC-N64
|
| JESD-609 Code |
e4
|
e4
|
| Length |
9 mm
|
9 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
LCC64,.35SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max |
469 mA
|
469 mA
|
| Supply Voltage1-Max |
1.155 V
|
1.155 V
|
| Supply Voltage1-Min |
1.045 V
|
1.045 V
|
| Supply Voltage1-Nom |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
9 mm
|
9 mm
|
| Base Number Matches |
1
|
1
|
|
|
|