DS90UB901QSQX
vs
DS90UB901QSQ/NOPB
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
Package Description |
,
|
LLP-32
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
JESD-30 Code |
S-XQCC-N32
|
S-PQCC-N32
|
Number of Terminals |
32
|
32
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
QUAD
|
QUAD
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
QFN
|
Pin Count |
|
32
|
Samacsys Manufacturer |
|
Texas Instruments
|
Differential Output |
|
YES
|
Driver Number of Bits |
|
1
|
JESD-609 Code |
|
e3
|
Length |
|
5 mm
|
Moisture Sensitivity Level |
|
3
|
Number of Functions |
|
1
|
Operating Temperature-Max |
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
|
3-STATE
|
Output Polarity |
|
COMPLEMENTARY
|
Package Code |
|
HVQCCN
|
Package Equivalence Code |
|
LCC32,.2SQ,20
|
Peak Reflow Temperature (Cel) |
|
260
|
Screening Level |
|
AEC-Q100
|
Seated Height-Max |
|
0.8 mm
|
Supply Current-Max |
|
90 mA
|
Supply Voltage1-Max |
|
1.89 V
|
Supply Voltage1-Min |
|
1.71 V
|
Supply Voltage1-Nom |
|
1.8 V
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
MATTE TIN
|
Terminal Pitch |
|
0.5 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
5 mm
|
|
|
|
Compare DS90UB901QSQX with alternatives
Compare DS90UB901QSQ/NOPB with alternatives