DS90LV032AW-QML
vs
5962-9865201QFA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
CERAMIC, MO-092AC, DFP-16
CERAMIC, MO-092AC, DFP-16
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Input Characteristics
DIFFERENTIAL
DIFFERENTIAL
Interface IC Type
LINE RECEIVER
LINE RECEIVER
Interface Standard
EIA-644; TIA-644
EIA-644; TIA-644
JESD-30 Code
R-GDFP-F16
R-GDFP-F16
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Low Current-Max
0.002 A
0.002 A
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DFP
DFP
Package Equivalence Code
FL16,.3
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
3.5 ns
3.5 ns
Receiver Number of Bits
4
4
Screening Level
MIL-PRF-38535 Class Q
MIL-PRF-38535 Class Q
Seated Height-Max
2.032 mm
2.032 mm
Supply Current-Max
15 mA
15 mA
Supply Voltage-Max
3.45 V
3.45 V
Supply Voltage-Min
3.15 V
3.15 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
6.35 mm
6.35 mm
Base Number Matches
2
3
Compare DS90LV032AW-QML with alternatives
Compare 5962-9865201QFA with alternatives