DS90LV031AW-QML vs DS26LV31TN feature comparison

DS90LV031AW-QML National Semiconductor Corporation

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DS26LV31TN Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Package Description CERAMIC, DFP-16 PLASTIC, DIP-16
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
High Level Input Current-Max 0.00001 A
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-644; TIA-644; IEEE P1596.3 EIA-422-B; V.11
JESD-30 Code R-GDFP-F16 R-PDIP-T16
JESD-609 Code e0
Moisture Sensitivity Level 1
Number of Functions 4 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Out Swing-Min 0.25 V
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP DIP
Package Equivalence Code FL16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified COMMERCIAL
Receive Delay-Max
Screening Level MIL-PRF-38535 Class Q
Seated Height-Max 2.032 mm 5.08 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) NOT SPECIFIED
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Transmit Delay-Max 3.5 ns 16 ns
Width 6.35 mm 7.62 mm
Base Number Matches 1 1
Part Package Code DIP
Pin Count 16
Length 21.755 mm

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