DS90LV031AW-QML vs DS26LS31CMX/NOPB feature comparison

DS90LV031AW-QML National Semiconductor Corporation

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DS26LS31CMX/NOPB National Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description CERAMIC, DFP-16 LEAD FREE, SOIC-16
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
High Level Input Current-Max 0.00001 A 0.00002 A
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-644; TIA-644; IEEE P1596.3 EIA-422; FED STD 1020
JESD-30 Code R-GDFP-F16 R-PDSO-G16
JESD-609 Code e0 e3
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Out Swing-Min 0.25 V 2 V
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP SOP
Package Equivalence Code FL16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Receive Delay-Max
Screening Level MIL-PRF-38535 Class Q
Seated Height-Max 2.032 mm 1.75 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V 5 V
Surface Mount YES YES
Technology CMOS BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37) Matte Tin (Sn)
Terminal Form FLAT GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Transmit Delay-Max 3.5 ns 15 ns
Width 6.35 mm 3.9 mm
Base Number Matches 1 1
Length 9.9 mm

Compare DS90LV031AW-QML with alternatives

Compare DS26LS31CMX/NOPB with alternatives