DS90LV018ATM
vs
DS90LV018AMDC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
0.150 INCH, PLASTIC, SOIC-8
DIE, DIE OR CHIP
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Input Characteristics
DIFFERENTIAL
DIFFERENTIAL
Interface IC Type
LINE RECEIVER
LINE RECEIVER
Interface Standard
EIA-644; TIA-644
EIA-644; TIA-644
JESD-30 Code
R-PDSO-G8
X-XUUC-N
JESD-609 Code
e0
Length
4.9 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Low Current-Max
0.002 A
0.002 A
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SOP
DIE
Package Equivalence Code
SOP8,.25
DIE OR CHIP
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE
UNCASED CHIP
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
2.5 ns
2.5 ns
Receiver Number of Bits
1
1
Seated Height-Max
1.75 mm
Supply Current-Max
9 mA
9 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Base Number Matches
4
1
Part Package Code
DIE
Compare DS90LV018ATM with alternatives
Compare DS90LV018AMDC with alternatives