DS90CF386SLCX vs DS90CF386SLCX/NOPB feature comparison

DS90CF386SLCX National Semiconductor Corporation

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DS90CF386SLCX/NOPB National Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description 0.80 MM PITCH, FBGA-64 0.80 MM PITCH, FBGA-64
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Input Characteristics DIFFERENTIAL DIFFERENTIAL
Interface IC Type LINE RECEIVER LINE RECEIVER
Interface Standard EIA-644; TIA-644 EIA-644; TIA-644
JESD-30 Code S-PBGA-B64 S-PBGA-B64
JESD-609 Code e0 e1
Length 8 mm 8 mm
Moisture Sensitivity Level 3 4
Number of Functions 4 4
Number of Terminals 64 64
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -10 °C -10 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA64,8X8,32 BGA64,8X8,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 235 260
Qualification Status Not Qualified Not Qualified
Receive Delay-Max
Receiver Number of Bits 4 4
Seated Height-Max 1.5 mm 1.5 mm
Supply Current-Max 135 mA 135 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 8 mm 8 mm
Base Number Matches 2 2

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Compare DS90CF386SLCX/NOPB with alternatives