DS90CF386SLCX
vs
DS90CF386SLCX/NOPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
0.80 MM PITCH, FBGA-64
0.80 MM PITCH, FBGA-64
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Input Characteristics
DIFFERENTIAL
DIFFERENTIAL
Interface IC Type
LINE RECEIVER
LINE RECEIVER
Interface Standard
EIA-644; TIA-644
EIA-644; TIA-644
JESD-30 Code
S-PBGA-B64
S-PBGA-B64
JESD-609 Code
e0
e1
Length
8 mm
8 mm
Moisture Sensitivity Level
3
4
Number of Functions
4
4
Number of Terminals
64
64
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-10 °C
-10 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA64,8X8,32
BGA64,8X8,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
235
260
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
Receiver Number of Bits
4
4
Seated Height-Max
1.5 mm
1.5 mm
Supply Current-Max
135 mA
135 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
8 mm
8 mm
Base Number Matches
2
2
Compare DS90CF386SLCX with alternatives
Compare DS90CF386SLCX/NOPB with alternatives