DS90CF386SLCX/NOPB
vs
DS90CF386MTDX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
TSSOP
Package Description
0.80 MM PITCH, GREEN, FBGA-64
TSSOP-56
Pin Count
64
56
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Input Characteristics
DIFFERENTIAL
DIFFERENTIAL
Interface IC Type
LINE RECEIVER
LINE RECEIVER
Interface Standard
EIA-644; TIA-644
EIA-644; TIA-644
JESD-30 Code
S-PBGA-B64
R-PDSO-G56
JESD-609 Code
e1
e0
Length
8 mm
14 mm
Moisture Sensitivity Level
4
2
Number of Functions
4
4
Number of Terminals
64
56
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-10 °C
-10 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TSSOP
Package Equivalence Code
BGA64,8X8,32
TSSOP56,.3,20
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Receiver Number of Bits
4
4
Seated Height-Max
1.5 mm
1.1 mm
Supply Current-Max
135 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Supply Voltage1-Max
3.6 V
Supply Voltage1-Min
3 V
Supply Voltage1-Nom
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
20
Width
8 mm
6.1 mm
Base Number Matches
2
2
Receive Delay-Max
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Compare DS90CF386MTDX with alternatives