DS90CF386MTDX/NOPB
vs
DS90CF386SLCX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
LOW PROFILE, PLASTIC, TSSOP-56
0.80 MM PITCH, FBGA-64
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Input Characteristics
DIFFERENTIAL
DIFFERENTIAL
Interface IC Type
LINE RECEIVER
LINE RECEIVER
Interface Standard
EIA-644; TIA-644
EIA-644; TIA-644
JESD-30 Code
R-PDSO-G56
S-PBGA-B64
JESD-609 Code
e3
e0
Length
14 mm
8 mm
Moisture Sensitivity Level
2
3
Number of Functions
4
4
Number of Terminals
56
64
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-10 °C
-10 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
LFBGA
Package Equivalence Code
TSSOP56,.3,20
BGA64,8X8,32
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
Receiver Number of Bits
4
4
Seated Height-Max
1.2 mm
1.5 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
6.1 mm
8 mm
Base Number Matches
2
2
Supply Current-Max
135 mA
Compare DS90CF386MTDX/NOPB with alternatives
Compare DS90CF386SLCX with alternatives