DS90CF383MTD/NOPB
vs
DS90CF383MTDX/NOPB
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
PLASTIC, TSSOP-56
|
LOW PROFILE, PLASTIC, TSSOP-56
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Differential Output |
YES
|
YES
|
Driver Number of Bits |
5
|
5
|
Input Characteristics |
STANDARD
|
STANDARD
|
Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
Interface Standard |
EIA-644; TIA-644
|
EIA-644; TIA-644
|
JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
JESD-609 Code |
e3
|
e3
|
Length |
14 mm
|
14 mm
|
Moisture Sensitivity Level |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
TOTEM-POLE
|
TOTEM-POLE
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP56,.3,20
|
TSSOP56,.3,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Receive Delay-Max |
|
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Current-Max |
55 mA
|
55 mA
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
6.1 mm
|
6.1 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare DS90CF383MTD/NOPB with alternatives
Compare DS90CF383MTDX/NOPB with alternatives