DS90C031BTMX
vs
DS90LV027AMWC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
0.150 INCH, PLASTIC, SOIC-16
DIE, WAFER
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
2
High Level Input Current-Max
0.00001 A
0.00001 A
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-644; TIA-644
EIA-644; TIA-644
JESD-30 Code
R-PDSO-G16
X-XUUC-N
JESD-609 Code
e0
Length
9.9 mm
Moisture Sensitivity Level
1
Number of Functions
4
2
Number of Terminals
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Out Swing-Min
0.25 V
0.25 V
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SOP
DIE
Package Equivalence Code
SOP16,.25
WAFER
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE
UNCASED CHIP
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
Seated Height-Max
1.75 mm
Supply Voltage-Max
5.5 V
3.6 V
Supply Voltage-Min
4.5 V
3 V
Supply Voltage-Nom
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Transmit Delay-Max
3.5 ns
1.5 ns
Width
3.9 mm
Base Number Matches
2
2
Compare DS90C031BTMX with alternatives
Compare DS90LV027AMWC with alternatives