DS7831MD8 vs AM26LS30DC feature comparison

DS7831MD8 National Semiconductor Corporation

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AM26LS30DC Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Package Description DIE, DIE OR CHIP DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CONFIGURABLE INTERFACE STANDARDS; INDIVIDUAL ENABLES PROGRAMMABLE SLEW RATE
Differential Output YES YES
Driver Number of Bits 2 4
High Level Input Current-Max 0.001 A
Input Characteristics GATED STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard GENERAL PURPOSE EIA-422; EIA-423
JESD-30 Code X-XUUC-N R-GDIP-T16
Number of Functions 2 4
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Out Swing-Min 2 V
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP DIP16,.3
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified
Receive Delay-Max
Screening Level 38535Q/M;38534H;883B
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Transmit Delay-Max 25 ns 200 ns
Base Number Matches 3 4
Length 22.86 mm
Number of Terminals 16
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare DS7831MD8 with alternatives

Compare AM26LS30DC with alternatives