DS5003FPM-16+
vs
S80C188EB-16
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
INTEL CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP, QFP80,.7X.9,32
|
QFP, QFP80,.7X.9,32
|
Pin Count |
80
|
80
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
15
|
20
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
NO
|
CPU Family |
8051
|
|
Clock Frequency-Max |
16 MHz
|
32 MHz
|
External Data Bus Width |
8
|
8
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
R-PQFP-G80
|
R-PQFP-G80
|
JESD-609 Code |
e3
|
e0
|
Length |
20 mm
|
20 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
4
|
|
Number of Terminals |
80
|
80
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
QFP80,.7X.9,32
|
QFP80,.7X.9,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
131072
|
|
Seated Height-Max |
3.4 mm
|
3.15 mm
|
Speed |
16 MHz
|
16 MHz
|
Supply Current-Max |
36 mA
|
90 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
1
|
2
|
|
|
|
Compare DS5003FPM-16+ with alternatives
Compare S80C188EB-16 with alternatives