DS34C87TM
vs
AM26LS31MFK
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOIC
|
QLCC
|
Package Description |
SOIC-16
|
QCCN, LDCC20,.4SQ
|
Pin Count |
16
|
20
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Differential Output |
YES
|
YES
|
Driver Number of Bits |
4
|
4
|
High Level Input Current-Max |
0.000001 A
|
0.00002 A
|
Input Characteristics |
STANDARD
|
STANDARD
|
Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
Interface Standard |
EIA-422
|
EIA-422-B; TIA-422-B; V.11
|
JESD-30 Code |
R-PDSO-G16
|
S-CQCC-N20
|
JESD-609 Code |
e0
|
|
Length |
9.9 mm
|
8.89 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
4
|
4
|
Number of Terminals |
16
|
20
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
SOP
|
QCCN
|
Package Equivalence Code |
SOP16,.25
|
LDCC20,.4SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
235
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Receive Delay-Max |
|
|
Seated Height-Max |
1.75 mm
|
2.03 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Transmit Delay-Max |
11 ns
|
20 ns
|
Width |
3.9 mm
|
8.89 mm
|
Base Number Matches |
4
|
2
|
Out Swing-Min |
|
2 V
|
|
|
|
Compare DS34C87TM with alternatives
Compare AM26LS31MFK with alternatives