DS31407GN2
vs
DS31400GN+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Microchip
|
|
Family |
DS31
|
|
Input Conditioning |
DIFFERENTIAL
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
17 mm
|
Logic IC Type |
PLL BASED CLOCK DRIVER
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Number of True Outputs |
4
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-DRAIN
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Power Supply Current-Max (ICC) |
416 mA
|
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Supply Voltage-Max (Vsup) |
1.98 V
|
|
Supply Voltage-Min (Vsup) |
1.62 V
|
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
fmax-Min |
0.002 MHz
|
|
Base Number Matches |
1
|
3
|
Part Package Code |
|
BGA
|
Package Description |
|
LBGA,
|
Pin Count |
|
256
|
HTS Code |
|
8542.39.00.01
|
Applications |
|
SONET;SDH
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Supply Voltage-Nom |
|
1.8 V
|
Telecom IC Type |
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare DS31407GN2 with alternatives
Compare DS31400GN+ with alternatives