DS31400GN+
vs
DS31400GN
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROSEMI CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA,
|
17 X 17 MM, CSBGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Applications |
SONET;SDH
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
2
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|