DS26LS33MJ/883 vs 5962-7802002MEX feature comparison

DS26LS33MJ/883 National Semiconductor Corporation

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5962-7802002MEX AMD

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Package Description CERAMIC, DIP-16 DIP,
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output NO
Driver Number of Bits 4
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE RECEIVER LINE RECEIVER
Interface Standard EIA-422; EIA-423; FED STD 1020; FED STD 1030 GENERAL PURPOSE
JESD-30 Code R-GDIP-T16 R-GDIP-T16
JESD-609 Code e0
Length 19.43 mm
Moisture Sensitivity Level 1
Number of Functions 1 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE
Output Low Current-Max 0.008 A
Output Polarity TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 25 ns 38 ns
Receiver Number of Bits 4 4
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm
Base Number Matches 3 6
Part Package Code DIP
Pin Count 16

Compare DS26LS33MJ/883 with alternatives

Compare 5962-7802002MEX with alternatives